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Embedded Processors

As vehicles become software defined processors designed for data centers are now required in harsher environments such as defence, aeronautics and passenger vehicles.

Cooling embedded components without low temperature, free flowing ambient air is difficult.
The desire for compact packaging is restricting typical cooling methods.
Software performance and features are limited if the next-gen processors cannot be used in vehicles.
Solution SheetView Use Cases

Which components can be cooled?

Calyos provides solutions for all types of embedded processors.

ECUs
SoCs
CPUs
GPUs
FPGAs
ASICs

What solutions does Calyos offer?

Calyos offers two solutions for cooling embedded processors, each with their own merits.

Loop Heat Pipes

LHPs provide the ability to not only handle very high heat flux, but also to transport heat over long distances.

Why this solution?

A high performance solution typically used for dissipating heat from >150W electronic components transporting the heat long distance to an appropriate cold source.

Ability to cool the latest high heat flux components effectively, increasing their efficiency.
Long distance transport of heat provides option to dissipate the heat passively, yet far away from the heat source itself.
Easily scalable to the number of components that require cooling, collecting the heat and dissipating it in one location.

How can you customize this solution?

Evaporator Size & Mounting

The size and mounting plates can be customized to your processor and socket.

Number of Evaporators

Multiple evaporators can be configured together using parallel lines.

Line Routing

Lines can be routed around other components on the PCB, plus flexible lines allow for serviceability.

Condenser Type & Size

Different technologies such as conductive plates and air exchangers can be used as needed.

Micro Channel Heat Pipes

MCHPs are a hybrid HP-PHP solution that remains a simple and lightweight ultra-efficient cooling solution.

Why this solution?

A low cost, simple solution typically used for dissipating heat from <150W electronic components to adjacent surfaces. The shape can be customized easily to suit your application.

Low cost, lightweight, unique aluminium heat pipe design provides passive heat dissipation.
Thin extrusion easily interfaces with electronic components and flat surfaces to dissipate heat.
Dielectric fluid poses no risk of short circuits and is sealed within the heat pipe.

How can you customize this solution?

Bends

Customize angle and location of bends to enable better integration within a battery pack.

Length

Customize the length based on the geometry of the cell.

Width & Thickness

Customize both the thickness and the width of the MCHP.

Cross Section Profile

Design new cross sectional shapes
(such as this triangular concept) to suit your geometry.

Our two-phase cooling systems always bring three clear benefits:

Passive & Pump Free

Ultra Reliable & Zero Maintenance

High HTC & Low Thermal Resistance

Use Cases

There are thousands of use cases for our technology. Here we have selected a few examples to give you an idea of how our solutions can be used. Don't be afraid if you have something different - reach out to us and we can validate the application through an initial feasibility analysis.

request feasibility Analysis
Low power cooling for an ECU using the side of the IP rated box to dissipate the heat.

E-Mobility

:

ECU

Low power cooling for an ECU using the side of the IP rated box to dissipate the heat.
A solution capable of cooling up to 800W, completely passively, using the conductive plate as a cold source. The design also operates in anti-gravity and has passed stringent military testing including dust, vibrations, accelerations, impact, and liquid ingress.

E-Mobility

:

Vehicle Mounted Computer

A solution capable of cooling up to 800W, completely passively, using the conductive plate as a cold source. The design also operates in anti-gravity and has passed stringent military testing including dust, vibrations, accelerations, impact, and liquid ingress.
In this application a high MTBF was critical. Our solution delivered that, while also ensuring an IP66 rating with a 100% passive solution (no fans). The cooling of two 150W components was achieved with completely natural convection.

E-Mobility

:

Rugged Computer

In this application a high MTBF was critical. Our solution delivered that, while also ensuring an IP66 rating with a 100% passive solution (no fans). The cooling of two 150W components was achieved with completely natural convection.

LHP-EE

Solution Sheet

Our solution sheet includes on general specification, operating information, system materials and typical evaporators and condensers.

Download Solution Sheet

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Schedule an introductory call with one of Calyos' two-phase experts.

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