A representative from Calyos will reach out to you to plan an introductory web call where they will explain how our technology works and demonstrate the applications and benefits of it.
Project
Location:
DATE:
.png)
NVIDIA's latest AI platforms (e.g., HGX B200 and HGX B300) are driving GPU TDPs beyond 1,000 W. Unlike some hyperscale data centers and large AI clusters, which have the capabilities to adopt high-power racks and new cooling infrastructures, many enterprises, edge-cloud operators, and smaller air-cooled data centers often lack the capabilities to adopt high power racks & invest in a massive thermal infrastructure change.
Yet these organizations increasingly require access to AI computing.
While air-cooled servers have traditionally been the preferred option, they now face 3 main thermal challenges :
- Management of thermal throttling
- Managing silicon hotspots.
- Packaging the entire cooling solution within a limited form factor.
So, is this the end of air-cooled AI servers ?
Not necessarily.
A new generation of Passive Two-Phase Direct-to-Chip-to-Air In-server Cooling technologies is opening another path. This path is designed to manage individual servers hitting +10 kW, and rack thermal loads up to 70kW. This means :
- Zero new data center cooling infrastructure required.
- Up to 80% lower server cooling power consumption.
- The same simplicity and reliability of traditional air-cooled operations.
As a technology provider, our goal with this series is to share practical insights into high-power server cooling and enable their efficient deployment to enable AI for everyone.
Coming up next in the series:
🔜 Part 1: Thermal Throttling and Hotspots Management with Passive Two-Phase Direct-to-Chip to Air in-server cooling.
Calyos is actively developing and deploying advanced cooling solutions for server and racks applications. We are working with industry leaders to ensure the new generation of AI servers operates with greater efficiency, reliability, and sustainability.
If you are designing AI servers , or tackling thermal management challenges in data center applications, we want to hear from you. Let’s work together to create robust, maintenance-free cooling solutions that push the boundaries of performance and reliability.
Any question? Contact our technical team : info@calyos-tm.com
Further reading:
Who We Are
Calyos is a leader in the design and manufacture of two-phase thermal management systems. Building on our heritage from Euro Heat Pipes (EHP) and their space technology expertise, we specialize in innovative cooling solutions that tackle the thermal challenges of tomorrow.
What We Do
We engineer advanced cooling technologies, including loop heat pipes, micro-channel heat pipes, and pulsating heat pipes, to optimize thermal performance across a variety of applications. Typically these include: power electronics, processors, and batteries, but we don't stop there we are continuing to develop and produce fully customizable solutions for other specific needs, for example e-motors and fuel cells.
Where We Operate
Calyos is headquartered in Charleroi, Belgium, where our engineering and production teams work side by side in a state-of-the-art facility. From this base, we serve a global clientele, providing our cutting-edge solutions across North America, Asia, Europe, and South America.
When We Started
Calyos was incorporated in 2014 as a spin-off from Euro Heat Pipes (EHP), which was established in 2001 and has become a major player in the European satellite market. Since then, Calyos has been adapting and evolving EHP's space-grade cooling technologies for terrestrial applications.
Why We Matter
Our mission is to lead the industry towards adopting the most effective and sustainable thermal management solutions. We aim to address the most pressing thermal challenges in the data-driven and electrified environments of today, leveraging passive cooling technologies to achieve superior efficiency and environmental stewardship.
How We Succeed
Our success is driven by our commitment to four core values:
1. Applied Knowledge - Transforming deep technical expertise into market-ready solutions.
2. Better Together - Emphasizing collaboration with all stakeholders to enhance our collective success.
3. Inherent Flexibility - Adapting our solutions and practices to keep pace with evolving market demands.
4. Continuous Research - Persistently innovating to maintain our leadership in thermal technology.
