Use Cases

There are thousands of use cases for our technology, below we have included many examples as to where our technology can be used. All of our use cases have been validated through client projects, including some with the partners listed below.
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Don't be afraid if you have something different - reach out to us and we can validate the application through a feasibility study.

Computing

Server

2x CPU

Here Calyos was targeting two 350W CPUs inside a 1U server chassis. The design was optimized for 75 CFM, ensuring quiet operation.

Servers

In collaboration with Streacom, Calyos developed a 100% passive solution to cool a CPU and GPU within this desktop form factor.

Computing

Streacom SG10

In collaboration with Streacom, Calyos developed a 100% passive solution to cool a CPU and GPU within this desktop form factor.

Personal Computers

Using a 280mm radiator mounted above the evaporator this solution is capable of cooling a processor dissipating 300W. This is ideal for reliability critical applications due to the inherent fit and forget nature of an LHP-EE solution.

Computing

Workstation

Workstation AIO

Using a 280mm radiator mounted above the evaporator this solution is capable of cooling a processor dissipating 300W. This is ideal for reliability critical applications due to the inherent fit and forget nature of an LHP-EE solution.

Personal Computers

Here a very low case temperature was targeted for a 300W FPGA in a 1U chassis by transporting the heat to an area where the air exchanger size and airflow can be maximized.

Computing

Server

1x FPGA

Here a very low case temperature was targeted for a 300W FPGA in a 1U chassis by transporting the heat to an area where the air exchanger size and airflow can be maximized.

Servers

Here one 600W CPU, with >150W hotspots, is inside a 2U chassis with 300CFM of airflow. Transporting the heat to the rear of the chassis enabled maximum airflow.

Computing

Server

1x CPU

Here one 600W CPU, with >150W hotspots, is inside a 2U chassis with 300CFM of airflow. Transporting the heat to the rear of the chassis enabled maximum airflow.

Servers

Use cases